Ansys 2024 R2: Thermal Integrity in the Ansys Electronics Desktop Update

Join us for an exclusive webinar during Ansys 2024 R2 updates. We'll showcase significant enhancements to our Thermal Integrity tools. Discover the latest in Icepak, Mechanical Thermal, and Mechanical Structural, with expanded capabilities.

This Ansys 2024 R2 webinar reviews the updates, enhancements, and new features of the Thermal Integrity tool—Icepak, Mechanical Thermal, and Mechanical Structural. Engineers developing technologies for telecommunications, HPC, automotive, A&D, and IoT applications will find many new capabilities and improvements in this update.

We will combine the thermal integrity story and show significant enhancements in existing flows, using new capabilities for an easier and more robust solution.

• Mesh Fusion in Icepak is markedly enhanced to enable robust meshing on complicated assemblies for insightful thermal results
• Icepak is expanding the capabilities of the GPU solver to encompass even more applications for impressively fast simulations
• Introduction of the structural stress/strain/deformation solver in AEDT for accurate and easy-to-use thermal expansion analysis

This webinar is hosted by Ansys. You can REGISTER HERE.