Mastering 3D-IC Design Challenges Through Advanced Simulation

Overview

One of the biggest challenges faced by 3D-IC and advanced packaging teams today is the accurate and efficient simulation of complex interposers and 3D-IC systems, which can significantly impact design cycles and product performance. Ansys HFSS-IC offers new and enhanced technologies that provide greater capacity and performance for the simulation of interposer and 3D-IC.

In this webinar, we will present the latest workflows and simulation technologies enabling engineering teams developing interposers and 3DIC systems to leverage the speed and accuracy of HFSS.

Learning Outcomes

• What is HFSS-IC?
• Key simulation settings for interposer extraction
• Stacked die, interposer, and package – how to model the full assembly

This webinar is hosted by Ansys. You can register via their website.